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IEC TR 62878-2-7:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

Standard Details

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

General Information

Status : ACTIVE
Standard Type: Main
Document No: IEC TR 62878-2-7:2019
Document Year: 2019
Pages: 12
Edition: 1.0
  • Section Volume:
  • TC 91 Electronics assembly technology
  • ICS:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies

Life Cycle

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ACTIVE
IEC TR 62878-2-7:2019
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